Overview
ASUS Prime series motherboards are expertly engineered to unleash the full potential of 13th Gen Intel Core processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME B760M-A WIFI D4 provides users and PC DIY builders with a range of performance optimizations.
  • Intel LGA 1700 socket - ready for 13th and 12th Gen Intel processors
  • Ultrafast connectivity - PCIe 4.0, two M.2 slots, Realtek 2.5 Gb Ethernet, rear USB 3.2 Gen 2, front USB 3.2 Gen 1 Type-C
  • Comprehensive cooling - VRM heatsinks, M.2 heatsink, PCH heatsink, hybrid fan headers
  • ASUS OptiMem II - careful routing of traces and vias, plus ground layer optimizations to preserve signal integrity for improved memory overclocking
  • Aura Sync RGB Lighting - onboard addressable Gen 2 headers and Aura RGB header for RGB LED strips, easily synced with Aura Sync-capable hardware
All-around energy efficiency The Power Saving function contains several settings can easily optimize power consumption and maximize energy savings. You can enable a CPU power limit, darken Aura lighting, and set the fan profile to a power saving mode. You can also toggle the Power Saver plan that is built into Microsoft Windows. Precise digital power control The Digi+ voltage-regulator module (VRM) delivers real-time control over voltage droop, automatically switching frequency and power-efficiency settings. It also allows you to fine-tune your CPU for ultimate stability and performance. M.2 heatsink M.2 heatsink wards off throttling that can occur with M.2 storage during sustained transfers. The heatsink is held in place by captive screws, and these removable captive screws help reduce risk of drops or loss during heatsink removal. VRM heatsinks and thermal pads VRM heatsinks and thermal pads improve heat transfer from the MOSFETs and chocks for better cooling performance. ProCool connector Proprietary connectors augment the motherboard's link to the PSU with 8 pin connectors that pass 12 volts of power directly to the processors. Each jack features solid pins that can handle more current than hollow-pin connectors. Six-layer PCB design Multiple PCB layers optimize heat management for critical components, providing more headroom to push CPUs beyond stock speeds. Stack Cool 3+ 2-ounce copper layers draw heat away from critical components to keep them at their optimal operating temperatures and provide more headroom to push CPUs beyond stock speeds. DDR4 support Improvements to trace routing design provide the latest Intel processors with enhanced access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk. ASUS OptiMem II Revisions to the motherboard's trace routing provide the latest processors with unrestricted access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce vias and adds shielding zones that significantly reduce crosstalk. Two M.2 slots (up to 64 Gbps) The PRIME B760 motherboard offers a total of two M.2 slots that support data-transfer speeds of up to 64 Gbps via PCIe 4.0, enabling quicker boot-up and app load times with OS or application drives. PCIe 4.0 slot The PRIME B760 motherboard is designed specifically for 13th and 12th Gen Intel CPUs and offer PCIe 4.0 connectivity for the GPUs. USB 3.2 Gen 1 Type-C Numerous USB ports support high-end rigs loaded with peripherals, including front USB Type-C connectors with fast USB 3.2 Gen 1 for transmission speeds of up to 5 Gbps. Realtek 2.5 Gb Ethernet Realtek 2.5 Gb Ethernet reduces CPU overhead and offers exceptionally high TCP and UDP throughput for faster, smoother data transfers.